We are the Major Adhesive Solution Provider to Sweden’s Fingerprints Card AB Which Holds 43% Market Share for Global Smartphone Fingerprint Sensor.
Our DAF can meet your FPS packaging requirement.
For more details, email Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Your Contact Information.
Our FOD DAF is designed for Die Embedding, it has good expanding (for DBG Process) & Pick-Up Property, Excellent HAST & Ultra Low CL-Ion (<50ppm).
Our FOD DAF is optimised for Blade & DBG Process for Die Separation and Die Pitching. It has Excellent Embedding and Fillet Control which enable Easy Pick-up.
Our Engineers use High Purity Epoxy/Hardener (CL<50ppm) to Achieve HAST (110C at 85%RH) 320 Hour Pass. Through Capturing CL Ion by ICA, it Prevents Corrosion.
No Distortion, No Void.
For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Contact Information.
