Contact Us on EMI Carrier Tape
Contact Us on Dicing & Back-Grinding Tape
Contact Us on Die-Die DAF, Die-PCB DAF, Die-Glass DAF
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Please Email to Sales@Skymart-Group.com or Simply
WhatsApp to +65 9863 5593, Wechat to CC13530245428 or Skype to cclau88
Our Die Attach Film (DAF) is Film used to Adhere Die to Die, Die to Substrate and Die to Glass when Manufacturing Semiconductor Packages.
芯片粘接薄膜是制造半导体封装时为了粘贴芯片与基板，芯片与芯片, 芯片与玻璃使用的薄膜。
| Use | To adhere die to substrate or die to die. SD Card, u-SD Card, DDP, QDP, ODP, and MCP, etc. |
|---|---|
| Characteristic | Excellent workability (no burr) Highly reliable (MRL 2) Long dwell time even at high temperature (150/2hr) We have the filler, no filler, precut, and non precut types |
| 使用 | 芯片与基板间或者芯片与芯片间粘合 SD Card, u-SD Card, DDP, QDP, ODP and MCP, etc |
|---|---|
| 特点 | 卓越的工作性（没有毛刺） 高信赖性(MRL 2) 在高温也长的停留时间(150/2小时) 保留填料类型与无填料类型，预切类型与无预切类型 |
For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Your Contact Information.
We are the Major Adhesive Solution Provider to Sweden’s Fingerprints Card AB Which Holds 43% Market Share for Global Smartphone Fingerprint Sensor.
Our DAF can meet your FPS packaging requirement.
For more details, email Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Your Contact Information.
Our FOD DAF is designed for Die Embedding, it has good expanding (for DBG Process) & Pick-Up Property, Excellent HAST & Ultra Low CL-Ion (<50ppm).
Our FOD DAF is optimised for Blade & DBG Process for Die Separation and Die Pitching. It has Excellent Embedding and Fillet Control which enable Easy Pick-up.
Our Engineers use High Purity Epoxy/Hardener (CL<50ppm) to Achieve HAST (110C at 85%RH) 320 Hour Pass. Through Capturing CL Ion by ICA, it Prevents Corrosion.
No Distortion, No Void.
For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Contact Information.
