Our Die Attach Film (DAF) is Film used to Adhere Die to Die, Die to Substrate and Die to Glass when Manufacturing Semiconductor Packages.
芯片粘接薄膜是制造半导体封装时为了粘贴芯片与基板，芯片与芯片, 芯片与玻璃使用的薄膜。
| Use | To adhere die to substrate or die to die. SD Card, u-SD Card, DDP, QDP, ODP, and MCP, etc. |
|---|---|
| Characteristic | Excellent workability (no burr) Highly reliable (MRL 2) Long dwell time even at high temperature (150/2hr) We have the filler, no filler, precut, and non precut types |
| 使用 | 芯片与基板间或者芯片与芯片间粘合 SD Card, u-SD Card, DDP, QDP, ODP and MCP, etc |
|---|---|
| 特点 | 卓越的工作性（没有毛刺） 高信赖性(MRL 2) 在高温也长的停留时间(150/2小时) 保留填料类型与无填料类型，预切类型与无预切类型 |
For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Your Contact Information.