Die Attach Film (DAF) For Die To Die/Substrate, Film Over Die (FOD), Fingerprint Sensor (FPS) – 芯片粘接薄膜, 芯片包裹薄膜, 指纹感应芯薄膜

Our Die Attach Film (DAF) is Film used to Adhere Die to Die, Die to Substrate and Die to Glass when Manufacturing Semiconductor Packages.

芯片粘接薄膜是制造半导体封装时为了粘贴芯片与基板,芯片与芯片, 芯片与玻璃使用的薄膜。

www.Skymart-Technologies.com

Use To adhere die to substrate or die to die.
SD Card, u-SD Card, DDP, QDP, ODP, and MCP, etc.
Characteristic Excellent workability (no burr)
Highly reliable (MRL 2)
Long dwell time even at high temperature (150/2hr)
We have the filler, no filler, precut, and non precut types
使用 芯片与基板间或者芯片与芯片间粘合
SD Card, u-SD Card, DDP, QDP, ODP and MCP, etc
特点 卓越的工作性(没有毛刺)
高信赖性(MRL 2)
在高温也长的停留时间(150/2小时)
保留填料类型与无填料类型,预切类型与无预切类型

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For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Your Contact Information.

Die Attach Film for FOD (Film Over Die) Application 芯片包裹薄膜

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Our FOD DAF is designed for Die Embedding, it has good expanding (for DBG Process) & Pick-Up Property, Excellent HAST & Ultra Low CL-Ion (<50ppm).

Our FOD DAF is optimised for Blade & DBG Process for Die Separation and Die Pitching.  It has Excellent Embedding and Fillet Control which enable Easy Pick-up.

Our Engineers use High Purity Epoxy/Hardener (CL<50ppm) to Achieve HAST (110C at 85%RH) 320 Hour Pass.  Through Capturing CL Ion by ICA, it Prevents Corrosion.

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No Distortion, No Void.

For More Details, Email to Sales@Skymart-Group.com or Contact +65 6747 7339 to Provide Contact Information.

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